CG:603005 China Wafer Level CSP Co., Ltd

China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices. The company also provides infrastructure solutions, including design, test, and logistics; design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services, including package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.

42.23 CNY
As of 01/28/2022


Security Information
Category1:  Global Equity
Category2:  Common stocks
Category3:  Emerging markets
GICS sector:  Unknown
Industry:  Semiconductors
Index country:  China
Country of incorporation:  China
IPO date:  02/10/2014
Stock exchange:    Shanghai Stock Exchange
Exchange country:   China
Market cap:   17,351,477,248 CNY
Current dividend yield:   0.49%
Sedol:      

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