HK:0522 ASM Pacific Technology Limited

ASM Pacific Technology Limited, an investment holding company, engages in the design, manufacture, and marketing of machines, tools, and materials used in the semiconductor and electronics assembly industries worldwide. It operates through three segments: Back-end Equipment, Surface Mount Technology Solutions, and Materials. The Back-end Equipment segment manufactures and markets a line of assembly and packaging equipment for the microelectronics, semiconductor, photonics, and optoelectronics industries. This segment's products include automatic optical inspection/FOL equipment, die attach equipment, CMOS imaging sensor equipment, dispensing equipment, factory automation equipment, encapsulation solutions equipment, automatic trim and form systems, test and finish handling systems, wafer separation systems, and wire bonding equipment, as well as LED testing, sorting, and taping systems. The Surface Mount Technology Solutions segment develops and sells DEK printers for the surface mount technology (SMT), semiconductor, and solar markets, as well as SIPLACE SMT placement solutions. The Materials segment engages in the production and sale of semiconductor packaging materials. It offers etched and stamped leadframes used by multinational chip manufacturers, independent integrated circuit assembly houses, and consumer electronics manufacturers; molded interconnect substrates; and IC and small signal discrete products. The company also engages in trading of surface mount technology equipment, and semiconductor equipment and materials; and the provision of marketing services. The company was founded in 1975 and is based in Kwai Chung, Hong Kong.

99.60 HKD
As of 06/15/2021


Security Information
Category1:  Global Equity
Category2:  Common stocks
Category3:  Developed markets ex-US
GICS sector:  Information Technology
Industry:  Semiconductor Equipment & Mate
Index country:  China
Country of incorporation:  Cayman Islands
IPO date:  01/03/2000
Stock exchange:    Hong Kong Exchange
Exchange country:   Hong Kong
Market cap:   41,695,793,152 HKD
Current dividend yield:   1.57%
CUSIP:    G0535Q133
ISIN:        KYG0535Q1331
Sedol:      6002453

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