NA:BESI BE Semiconductor Industries N.V
BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries. The company's principal products include die attach equipment, such as single chips, multi chips, multi modules, flip chips, TCB and eWLB die bonding systems, and die sorting systems; packaging equipment comprising molding, trim and form, and singulation systems; and plating equipment consisting of tin, copper, and precious metal plating systems, as well as related process chemicals. It also offers tooling, conversion kits, spare parts, and other services. The company provides its products primarily to chip manufacturers, assembly subcontractors, and electronics and industrial companies in the Netherlands, Austria, Switzerland, Malaysia, Singapore, and China. BE Semiconductor Industries N.V. was founded in 1995 and is headquartered in Duiven, the Netherlands.
62.82 EUR
As of 01/19/2023
Security Information
Category1: Global Equity
Category2: Common stocks
Category3: Developed markets ex-US
GICS sector: Information Technology
Industry: Semiconductor Equipment & Mate
Index country: The Netherlands
Country of incorporation: The Netherlands
IPO date: 09/10/2001
Stock exchange: Nyse Euronext - Euronext
Exchange country: The Netherlands
Market cap: 4,078,083,584 EUR
Current dividend yield: 6.38%
Sedol: BG0SCK9